Lecture 1 - Introduction - 1
Lecture 2 - Introduction - 2
Lecture 3 - Introduction - 3
Lecture 4 - Semiconductors and Components - 1
Lecture 5 - Semiconductors and Components - 2
Lecture 6 - 1st Level Packaging - I
Lecture 7 - 1st Level Packaging - II
Lecture 8 - Area Array Packages - I
Lecture 9 - Area Array Packages - II
Lecture 10 - Area Array Packages - III
Lecture 11 - Flip Chip Technology
Lecture 12 - 1st Level Interconnections - I
Lecture 13 - 1st Level Interconnections - II
Lecture 14 - 1st Level Interconnections - III
Lecture 15 - Advanced Packaging
Lecture 16 - 2nd Level Packaging: PCB - I
Lecture 17 - 2nd Level Packaging: PCB - II
Lecture 18 - 2nd Level Packaging: PCB - III
Lecture 19 - 2nd Level Packaging: PCB - IV
Lecture 20 - 2nd Level Packaging: PCB - V
Lecture 21 - System Integration
Lecture 22 - Thermal Management 1: Introduction
Lecture 23 - Thermal Management 2: Concepts
Lecture 24 - Thermal Management 3: Thermal Resistance
Lecture 25 - Thermal Management 4: Heat Sink
Lecture 26 - Thermal Management 5: Heat Sink Characterization
Lecture 27 - Thermal Management 6: Heat Transfer Correlations
Lecture 28 - Thermal Management 7: Practice Problems
Lecture 29 - Thermal Management 8: Thermal Technologies
Lecture 30 - Thermal Management 9: Novel Cooling Technologies
Lecture 31 - Shock and Vibration - 1
Lecture 32 - Shock and Vibration - 2
Lecture 33 - Shock and Vibration - 3
Lecture 34 - Shock and Vibration - 4
Lecture 35 - Electronic Packaging Reliability - 1
Lecture 36 - Electronic Packaging Reliability - 2
Lecture 37 - Electronic Packaging Reliability - 3
Lecture 38 - Electronic Packaging Reliability - 4
Lecture 39 - Power Electronics Packaging
Lecture 40 - Special Topics